The National Advanced Packaging and Integration Center is housed at ANZIC. The center was set up by DER, UKG, SE,SG and University of Strathclyde. The center is the only open access R&D facility in the UK for Advanced Semiconductor packaging. The center, when fully commissioned, will package Power, Photonics, Advanced CMOS and Quantum devices. The center will allow UK semiconductor fabs to have devices packaged here in the UK rather than sending them to international packaging facilities in the Far East, Europe and North America. The center underpins many of the critical technologies that rely on the devices that can be packaged in Glasgow.
NASPIC
Open for R&D and collaborations
About NASPIC
Open for R&D and collaborations
Anything to do with Semiconductor packaging.
Contact Details
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National Manufacturing Institute Scotland Netherton Renfrew
National Manufacturing Institute Scotland Netherton Renfrew
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