Full 200mm semiconductor fabrication class 10 cleanroom facility with dedicated staff or access for external staff to be trained and pay for use. Capabilities include sub micron lithography, Atomic Layer Deposition (ALD), metal deposition by e-beam or sputtering, ICP dry etch, PECVD and furnace deposition. We can also provide material analysis including SEM with EDX, XPS, XRD, ALD, ellipsometry and profilometer. We can also perform small scale packaging and back end processing such as dicing and backgrinding.
University of Edinburgh – Scottish Microelectronics Centre
Open for R&D and collaborations
About University of Edinburgh – Scottish Microelectronics Centre
Open for R&D and collaborations
Any collaboration requiring fabrication or material characterisation.
Contact Details
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Scottish Microelectronic Centre, Edinburgh University Alexander CRUM Brown Road, EH93FF
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Scottish Microelectronic Centre, Edinburgh University Alexander CRUM Brown Road, EH93FF
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